ST offers a complete range of integrated EMI filters and ESD protection devices specifically developed for interfaces used in mobile communication and multimedia applications for microphones, memory cards, HDMI or USB interfaces, for instance.

Parallel and analog interfaces are covered with EMI low-pass filters (EMIF series), while differential buses use common-mode filters (ECMF™ series).
Both integrate high-performance ESD protection providing a very low residual clamping voltage.

CSP and plastic packages are proposed for both the EMIF and ECMF™ series.

Introduction This document provides package and usage recommendation information for 200 µm (min.) pitch Flip Chips. For information on 500 µm Flip Chips, see Application note AN1235. For information on 400 µm Flip Chips, see Application note AN2348. The competitive market of portable equipment, notably the mobile phone market, is driven by a challenging development of highly integrated products. To allow manufacturers of portable equipment to reduce the dimension of their products, STMicroelectronics has developed packages with reduced size, thickness and weight in the form of the Flip Chip. The electrical performance of such components in Flip Chips is improved thanks to shorter connections than the ones in standard plastic packages (such as TSSOP, SSOP or BGA). Figure 1. Micro-bumped flip-chip packages The Flip-Chip package family has been designed to fulfill the same quality levels and the same reliability performances as standard semiconductor plastic packages. This means these new Flip-Chip packages should be considered as new surface mount devices which will be assembled on a printed circuit board (PCB) without any special or additional process steps required. In particular this package does not require any extra underfill to increase reliability performances or to protect the device. This package is compatible with existing pick and place equipment for board mounting. Only lead-free, RoHS compliant Flip Chips are available in mass production. This application note addresses the following topics: • Product description • Mechanical description • Packing specifications and labeling description • Recommended storage and shipping instructions • Soldering assembly recommendations • User responsibility and returns • Changes • Delivery quantity • Quality